LODDEPASTA BLYFRI BLT 500GR (70-UFP-T4-ZQ-SAC)

LODDEPASTA BLYFRI BLT 500GR (70-UFP-T4-ZQ-SAC)
Varenr.
LFSUFPT4ZQ
Lager
Velg varians
Pris
Fra kr 1 071,00 Eks. MVA
Veil.
kr 1 190,00

Kvantumsrabatt

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LFS-UFP-ZQ has been formulated to provide increased stability at room temperatures whilst maintaining excellent printing and wetting properties.

LFS-UFP-ZQ gives bright, smooth and shiny void free solder joints with low, clear, post process residues that make for reliable pin probe testing.

LFS-UFP-ZQ is particularly suitable for fine pitch printing due to reduced particle size.

Benefits:

  • Stable for up to 1 month at 35°C
  • Extended screen life, reduces wastage
  • Decreased “head in pillow” problem
  • Constant viscosity during 7 days continuous printing
  • Constant viscosity during storage for 30 days at up to 35°C
  • Superior wetting and spreading characteristics
  • Reduces or eliminates voiding, particularly under BGA’s
  • High resistance to slumping
  • High humidity resistance
  • High resistance to solder balling
  • Extended stencil life
  • 72 hour tack time
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